? semiconductor components industries, llc, 2016 may, 2016 ? rev. 0 1 publication order number: ncs37012/d ncs37012 self test ground fault circuit interrupter (gfci) description the ncs37012 is a fully ul943 compliant signal processor for gfci applications with self test. the device integrates a flexible power supply (including both shunt and ldo regulators), differential fault, and grounded-neutral detection circuits. proprietary impedance measurement and signal processing techniques are used to minimize the number of external components and improve performance. the device also includes a specialized dsp controller that offers best in class immunity to nuisance loads without the need for external analog filters. self test is monitored every 17 minutes through an external current path and internally generated grounded neutral fault. features ? 6.0 v ? 12 v operation (120 ? 480 v ac mains with the appropriate series impedance) ? ?40 to 85 c ? very low power consumption: <15 mw @ 5 v ? 16 pin qfn package or 20 pin tssop package ? single current transformer (ct) detection of both differential and grounded?neutral faults ? full self test and trip indicator monitoring ? self syncing internal oscillator adjusts to ac mains frequency to guarantee full resolution on 50 and 60 hz distribution systems ? optimized solenoid deployment (coil is not energized near the ac mains zero crossings) ? randomized testing sequence to minimize noise and potential interactions on the ac mains ? >5 ma scr driver for use with high igt scr?s for improved noise immunity ? superior immunity to nuisance loads/noise (up to 10 a) without loss of detection capability or ct saturation ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? load panel gfci breakers ? gfci receptacles ? in?line gfci circuits (power cords) 1 www. onsemi.com qfn16 mn suffix case 485g marking diagrams pin connections xxxxx = specific device code a = assembly location l = wafer lot y = year w = work week = pb?free package 37012 mng alyw mld ctresgn ctbias ctstim ctresd idf supply scrdrv gnd (top view) device package shipping ? NCS37012MNTWG qfn16 (pb?free) 3000 / tape & reel ordering information ncs37012dbrg tssop20 (pb?free) 2500 / tape & reel 1 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. 1 20 tssop?20 da suffix case 948e 3701 2dbg alyw (note: microdot may be in either location)
ncs37012 www. onsemi.com 2 control logic ground fault idf supply te self trimmed rc osc waveform generator hv bandgap por brown out scrdrv driver vbias low pass filter ctbias ctstim ctresgn ground + + ? ? avdd/ dvdd mixer differential current detection grounded neutral detection offset correction gn randomizer mains level detector / lockout mld ctresd tripen pz figure 1. simplified block diagram digital filter led(1) led(0) ptt gn detection self test ti detector gftest
ncs37012 www. onsemi.com 3 table 1. pin function description ? qfn pin # name pad description 0 ground qfn center slug 1 mld mains level detect (zero cross) 2 ctresgn determines iv converter gain for detection threshold / matched to ct turns ratio (ground-neutral) 3 ctbias direct connection to the ct 4 ctstim direct connection to the ct 5 ctresd determines iv converter gain for detection threshold / matched to ct turns ratio (differential current) 6 idf front end noise filter capacitor 7 gftest output to induce external differential current 8 tripen (h) trip / (l) no trip on self test failure 9 pz piezo output driver 10 nc tie to ground or leave floating 11 ptt push to test input 12 ti tip indicator input 13 led[0] led[0] output driver 14 led[1] led[1] output driver 15 scrdrv used to trigger the solenoid at a fault detection 16 supply power supply table 2. pin function description ? tssop pin # name pad description 1 ctstim differential and ground to neutral stimulus point for the current transformer 2 ground ground connection for ic 3 ctresd determines iv converter gain for detection threshold / matched to ct turns ratio (differential current) 4 idf determines corner frequency of the differential current path filter 5 gftest output to induce external differential current 6 tripen (h) trip / (l) no trip on self test failure 7 pz piezo output driver 8 nc tie to ground or leave floating 9 ptt push to test input 10 ti tip indicator input 11 ground ground connection for ic 12 led[0] led[0] output driver 13 led[1] led[1] output driver 14 scrdrv used to trigger the solenoid at a fault detection 15 dvdd internal digital 5 v regulated supply 16 avdd internal analog 5 v regulated supply 17 supply 12 v shunt regulated power supply 18 mld mains level detect (zero cross) and am slope detect (for oscillator sync/trim and am init) 19 ctresgn determines iv converter gain for detection threshold / matched to ct turns ratio (ground-neutral) 20 ctbias external 2 v bias for the current transformer
ncs37012 www. onsemi.com 4 table 3. absolute maximum ratings rating symbol value unit supply voltage range vs 6.0 to 12 v v input voltage range (note 1) v in ?0.3 to 6.0 v output voltage range v out ?0.3 to 6.0 v or (v in + 0.3), whichever is lower v maximum junction temperature t j(max) 140 c storage temperature range t stg ?65 to 150 c esd capability, human body model (note 2) esd hbm 2 kv esd capability, machine model (note 2) esd mm 200 v lead temperature soldering reflow (smd styles only), pb?free versions (note 3) t sld 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. refer to electrical characteristics and application information for safe operating area. 2. this device series incorporates esd protection and is tested by the following methods: esd human body model tested per aec?q100?002 (eia/jesd22?a114) esd machine model tested per aec?q100?003 (eia/jesd22?a115) latchup current maximum rating: 150 ma per jedec standard: jesd78 3. for information, please refer to our soldering and mounting techniques reference manual, solderrm/d table 4. thermal characteristics rating symbol value unit thermal characteristics, qfn16, 3x3.3 mm (note 4) thermal resistance, junction?to?air (note 5) thermal reference, junction?to?lead2 (note 5) r ja r jl tbd tbd c/w thermal characteristics, tssop?20 (note 4) thermal resistance, junction?to?air (note 5) r ja tbd c/w 4. refer to electrical characteristics and application information for safe operating area. 5. values based on copper area of 645 mm 2 (or 1 in 2 ) of 1 oz copper thickness and fr4 pcb substrate. table 5. operating ranges (note 6) parameter conditions min typ max units operating temperature ?40 85 c idd in typical power state 2.0 ma stimulus generator frequency tri?tone 3.1 3.4 khz scr trigger current 8.0 ma scr trigger output voltage with 5 v supply 4.5 5.5 v fault current sensitivity programmable with ctresd 4.6 4.8 5.0 ma ground fault response time 5 ? 20 ma 150 ms ground fault response time 20 ? 40 ma 75 ms ground fault response time >40 ma 25 ms saturation fault response time >300 ma 1.4 ms ct turns ratio 200 300 ground ? neutral detection threshold total series impedance (rn and rg) 3.0 6.0 internal oscillator frequency 2.0 mhz ct stimulus current internally limited 1.0 ma ct driver closed loop bw 500 khz product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 6. refer to electrical characteristics and application information for safe operating area.
ncs37012 www. onsemi.com 5 applications information figure 2. typical application schematic phase resmld line load capgn resled resgn mld ctresgn ctbias ctstim te ti ptt ctresd supply scrdrv phas e capscr resti capidf capsup resmain resgftst resd tripen idf neutral neutral gftest led[1] led[0] loa d_phas e pz capct capbias q2 q1
ncs37012 www. onsemi.com 6 recommended external components: component type instance value note scr q1 - on-mcr08 diode dx - on-1n4007 npn q2 - mmbt6517lt1g led lx - led pins drive opposite polarities capacitor capsup 3.3 f for a full bridge rectifier capacitor capgn 1-10 nf matched to current transformer capacitor capidf 220 nf sets the differential corner frequency at 1 khz capacitor capbias 10 nf filtering component for ctbias voltage capacitor capct 2.2 - 10 nf filtering and resonant capacitor for ct capacitor capscr - filtering component resistor resd 40 - 80k matched to current transformer resistor resgn 100 - 400k matched to current transformer resistor resmld 400 - 800k limiting resistor for the mains level detector (mld) input resistor resti 400 - 800k limiting resistor for the trip indicator (ti) input resistor resmain 10k for a full bridge rectifier resistor resgftst 15k sets the external differential test current (8 ma) resistor resled 1-5k sets the brightness of the leds tvs t1 - 250-400v led and speaker functions device function device state led[0] led[1] speaker normal no power / line load reversed off low off power up high for 500 ms low off reset (entered through ptt) high for 500 ms then low high on (250 ms) tripped low high off abnormal self-test fails (tripped) (blink) high low off self-test fails (reset) (blink) high low on no trip on fault (blink) high low on filtering the analog signal capture portion of the ic includes a single pole filter that can be set externally with cidf. this provides an additional layer of protection against false tripping under steady state noise conditions. high frequency steady state noise is common with pumps, motors or other cyclic noise generators. cidf = 220 nf = 1 khz low pass. for additional filtering suggestions please contact on semiconductor. setting trip sensitivity the ctresd resistor sets the threshold for the dif ferential current fault levels. increasing ctresd causes the fault levels to trip at lower differe ntial currents. ct efficiency at 60 hz must be considered. . ctresd= 400*#turns ? subject to ct efficiency at 60 hz the ctresgn resistor sets the threshold for ground to neutral fault detection. the rt parameter is the desired ground to neutral resistance trip level. higher ctresgn values will cause the part to trip at higher ground to neutral impedances. ctresgn = #t urns^2 x rt/2 ? subject to ct ef ficiency from 3 khz to 4 khz
ncs37012 www. onsemi.com 7 setting grounded ? neutral response time cgn is used to define the response time of the grounded?neutral detection circuit. the analog portion converts the impedance into a dc voltage and a high frequency (aliased) component. the capacitor is used to remove the high frequency component leaving just the dc representation of the impedance. ctcapgn= 1.8e-4/ctresgn self test automatic self test will occur every 17 minutes. if a failure is observed it will be retested every second until it passes. if it fails 8 successive tests then the gfci will indicate that it has failed self test. see the led and speaker functions table to see the different self test indicators. if tripen is asserted high the gfci unit will trip. differential ground fault test ? tests the ct and the internal differential detection signal path by asserting the gftest output high for 2 half cycles. the test will pass if a 6-8 ma differential current is enabled during these two half waves. greater than 20 ma current during this test will cause a fault to be detected. ground neutral fault test ? tests the internal ground neutral stimulus and detection paths by enabling an internal 50k resistor between the ctstim and ctbias pins. if the resistor and capacitor on ctresgn are connected this will pass the gn self test. ptt when the ptt input pin is de-asserted for greater than 80 ms a self test will be performed. if this test is successful the scr will be fired which will trip the gfci unit. if the test is unsuccessful the led[0] pin will flash indicating a failure.
ncs37012 www. onsemi.com 8 package dimensions tssop?20 case 948e?02 issue c dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?. 110 11 20 pin 1 ident a b ?t? 0.100 (0.004) c d g h section n?n k k1 jj1 n n m f ?w? seating plane ?v? ?u? s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 --- --- s u 0.15 (0.006) t 7.06 16x 0.36 16x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
ncs37012 www. onsemi.com 9 package dimensions ??? ??? ??? case 485g issue f 16x seating plane l d e 0.10 c a a1 e d2 e2 b 1 4 8 9 16 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. b a 0.10 c top view side view bottom view pin 1 location 0.05 c 0.05 c (a3) c note 4 16x 0.10 c 0.05 c a b note 3 k 16x l1 detail a l alternate terminal constructions ?? ?? *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended 2x 0.50 pitch 1.84 3.30 1 dimensions: millimeters 0.58 16x 2x 0.30 16x outline package 2x 2x 0.10 c a b e/2 soldering footprint* dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.03 0.05 a3 0.20 ref b 0.18 0.24 0.30 d 3.00 bsc d2 1.65 1.75 1.85 e 3.00 bsc e2 1.65 1.75 1.85 e 0.50 bsc k 0.18 typ l 0.30 0.40 0.50 l1 0.00 0.08 0.15 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncs37012/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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